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LE-37P 首页 > 产品介绍


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Support Intel® Tiger Lake / 11th Gen H Processor. 
DDR4 up to 32 GB, integrated HDMI, DisplayPort, LVDS, 1 x Giga PHY LAN, 1 x 2.5G Giga LAN, 
6 x USB 3.2 Gen2, 1 x USB3.2 Gen2 (Type E), 2 x USB 2.0, 2 x RS232/422/485, 2 x RS232, HD Audio, 
1 x SIM slot, 2 x SATA3 with RAID, GPIO, SMBus, 1 x Mini-PCIe socket (support mSATA), 1 x M.2 
(Key E 2230), 2 x M.2 (Key M 2280), 1 x SIM slot.


| Overview | Feature | Specification | Product Image | Ordering Guide |
| Datasheet (PDF format) | Manual | Driver | BIOS |


Overview 
Taiwan Commate Computer Inc.(COMMELL), the worldwide leader of Industrial Single Board Computers,
unveiled LE-37P 3.5 inch Miniboard embedded system board based on Intel® Tiger Lake /11th Gen H processors.
The LE-37P 3.5 inch Miniboard platform is designed for Intel® Tiger Lake /11th Gen H processors 
in the FCBGA1787 sockets.support DDR4 memory (One DDR4 SO-DIMM 3200 MHz up to 32GB).

The platform is based on Intel® 11th Gen integrated UHD Graphics, this GPU offers 32 execution units (EUs) 
clocked at up to 1350Mhz(depending on the CPU model). Displays can be connected via one LVDS,
one HDMI and one DP port up to Triple displays can be controlled simultaneously. LE-37P offers lots of features 
including high-speed data transfer interfaces such as 6 x USB3.2 Gen2 and 2 x SATA3, equipped with dual 
Gigabit Ethernet, and comes with 2 x RS232 and 2 x RS232/422/485, 2 x USB2.0, Intel® High Definition Audio, 
and 1 x MiniPCIe socket (support mSATA), 1 x M.2 (Key E 2230), 2 x M.2 (Key M 2280) for NVMe, 1 x SIM slot.  

Feature

  • CPU: Intel® Tiger Lake / 11th Genb H Processor in the FCBGA1787 sockets.

  • Memory: 1 x DDR4 3200 MHz SO-DIMM up to 32 GB, support Non-ECC, unbuffered memory.

  • Integrated Graphics: Intel® 11th Gen integrated UHD Graphics.

  • LVDS interface: Onboard 18/24-bit single/dual channel LVDS connector with +3.3V/+5V/+12V supply

  • DisplayPort interface: Onboard DisplayPort connector.

  • HDMI interface: Onboard HDMI connector.

  • LAN Interface: 1 x Intel® i219-LM Gigabit PHY LAN (Support iAMT 15.0), 1 x Intel® i225-LM Gigabit LAN (up to 2.5GbE).

  • Serial ATA: Support 2 x SATA3.

  • Audio: Realtek ALC888S High Definition Audio.

  • Internal I/O: 2 x SATA3, 2 x RS232, 2 x RS232/422/485, 2 x USB2.0, 1 x LVDS, 1 x LCD inverter conector, 1 x GPIO, 1 x Audio, 1 x SMBus, 1 x USB3.2 Gen2 (Type E).

  • Rear I/O: 1 x DisplayPort, 1 x HDMI, 6 x USB3.2 Gen2, 2 x LAN, 1 x DC jack.

  • Extended interface:

    1 x MimiPCIe card with SIM slot(support mSATA)

    1 x M.2 (Key M 2280) support PCIe Gen4 and SATA

    1 x M.2 (Key M 2280) support PCIe Gen4

    1 x M.2 (Key E 2230) for Wi-Fi and Bluetooth.

  • GPIO interface: Onboard programmable 8-bit Digital I/O interface.

  • Power requirement: DC jack 9~35V.

Specification

Form Factor

3.5" Single Board Computer

Processor

Intel® Tiger Lake / 11th Gen H Processor

Package Type: FCBGA1787

Memory

1 x 260-pin DDR4 3200 MHz SO-DIMM up to 32GB (Support Non-ECC, unbuffered memory)

Integrated Graphics

Intel® 11th Gen integrated UHD Graphics

Real Time Clock  

Chipset integrated RTC with onboard lithium battery  

Watchdog Timer

Generates a system reset with internal timer for 1min/s ~ 255min/s

Serial ATA Interface

Intel® built-in 2 x Serial ATA3 interface up to 600MB/s 

Support RAID 0, 1 and Intel Rapid Storage Technology.

LVDS Interface

Onboard 24-bit dual channel LVDS connector with +3.3V/+5V/+12V supply

 DisplayPort Interface  Onboard DisplayPort connector
 HDMI Interface  Onboard HDMI connector

Audio Interface

 
Realtek ALC888S HD Audio

LAN Interface

1 x Intel® i219-LM Gigabit PHY LAN (Support iAMT 15.0), 1 x Intel® i225-LM Gigabit LAN

GPIO Interface

Onboard programmable 8-bit digital I/O interface

Extended Interface 

1 x MimiPCIe card with SIM slot(support mSATA)

1 x M.2 (Key M 2280) support PCIe Gen4 and SATA

1 x M.2 (Key M 2280) support PCIe Gen4

1 x M.2 (Key E 2230) for Wi-Fi and Bluetooth

Internal I/O Port

2 x SATA3, 2 x RS232/422/485, 2 x RS232, 2 x USB2.0, 1 x LVDS, 1 x LCD inverter connector, 1 x GPIO, 1 x Audio (MIC-in & Line-out), 1 x SMBus, 1 x USB3.2 Gen2 (Type E)

Rear I/O Port

1 x DisplayPort, 1 x HDMI, 6 x USB3.2 Gen2, 2 x LAN, 1 x DC jack

Power Requirement

  DC jack 9~35V

Board Dimension

146 mm x 101 mm (L x W)

Temperature

Operating within 0 ~ 60°C (Note1)

Storage within -20 ~ 80°C

Relative Humidity

10%~90%, non-condensing

Ordering Guide

LE-37P7

With CoreTM i7-11850HE, QM850E + Cooler Fan, support HDMI, DP, LVDS

ADP-3355

DisplayPort to VGA module (For VGA)

ADP-3460

DisplayPort to LVDS module (For 2nd LVDS)

Note1: W-11865MRE,W-11865MLE,W-11555MRE,W-11555MLE,W-11155MRE,W-11155MLE W series can operate within -40°C~85°C (-40°F~185°F).

Note2: If you want to use other TGL H CPU (i5-11500HE, i3-11100HE, W-11865MRE, W-11865MLE, W-11555MRE, W-11555MLE, W-11155MRE, W-11155MLE, 6600HE), please contact with our sales.

Note3: There are two module (ADP-3355, ADP-3460), and you can choose one to support VGA or 2nd LVDS, please contact with our sales for OEM version.